TG-30 Thermal Compound

TG-30 Thermal Compound

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Description

TG-60 Liquid Metal Compound – Thermaltake USA

[Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/mk. [All-In-One Application Kit]

Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A

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Thermaltake TG-60 Liquid Metal Compound, High Thermal Conductivity of 52 W/m-k, Excellent Cooling Performance, Avoid Contact with Aluminum, CL-O034-GROSGM-B : Electronics

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