MacroVoids in assembled BGA packages

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C.

Micromachines, Free Full-Text

Recent developments in advanced polymeric materials for solder

Introduction to BGA Package - Utmel

Assembly Guidelines for MicroFET™ 1.6x1.6mm Dual Packaging

Acoustic Inspection of Hybrid Systems on Laminated Substrates

A Comprehensive Guide to BGA Substrates

BGA models with macro voids at different locations.

Bga Assembly, Ball Grid Array Assembly Expert Manufacturer with X

BGA Assembly Sierra Circuits

Different Types of BGA (Ball Grid Array) Packages - RAYPCB

Microsection Inspection / Constructional Analysis

Overview of Selected Issues Related to Soldering

Microsectioning inspection of assembled capacitors